Analysis of Substrate Coupling in Design of Mixed signal VLSI circuit for 0.18 μm Technology using Resistive Macromodel Method

Authors

Pawan Kumar Singh, Electronics and Communication Engineering Department, Thapar University, Patiala, 147004, IndiaFollow
Sanjay Sharma, Electronics and Communication Engineering Department, Thapar University, Patiala, 147004, IndiaFollow

Author Country (or Countries)

India

Abstract

In this paper the effects of substrate coupling on analog circuits in a mixed-signal chip are described and analyzed based on simulated results. Substrate coupling is a major challenge for mixed-signal design. To analyse the substrate coupling with digital circuits and analog circuit simulation accurate substrate model is important in the modern mixed-signal IC design. At the higher operating frequency the capacitive effect in substrate becomes important and the substrate impedances become frequency dependent in lightly doped substrate. To balance this, heavily doped substrate is used for the analysis and assumed as resistive network. The noise coupling is demonstrated by simulation on 0.18 mm heavily doped CMOS process.

Recommended Citation

Kumar Singh, Pawan and Sharma, Sanjay (2015) "Analysis of Substrate Coupling in Design of Mixed signal VLSI circuit for 0.18 μm Technology using Resistive Macromodel Method," Applied Mathematics & Information Sciences: Vol. 09: Iss. 6, Article 29.
Available at: https://digitalcommons.aaru.edu.jo/amis/vol09/iss6/29