Resistivity of Bilayers Ni/Pd Films and Ni1-xPdx Alloys Films

Authors

M. K. Loudjani, Université Paris-Saclay, ICMMO-UMR 8182 (CNRS), SP2M, Bâtiment 410, Rue du Doyen Georges Poitou 91405 Orsay Cedex, FranceFollow
C. Sella, Institut des Nano-Sciences de Paris, Université de Paris-VI, campus Boucicaut, 140 rue de Lourmel 75015 Paris, FranceFollow

Abstract

In this study, we present the resistivity measurements on pure metal films Ni, Pd, on binary alloys films Ni1-xPdx and on bilayers Ni/Pd films. We will analyze the effect of disorder related to the random distribution of elements in solid solution on the alloy Ni1-xPdx film resistivity. We used two types of substrates: glass-Corning and a polycrystalline a- alumina. The resistivity Ni1-xPdx alloy films at ambient temperature presents two maxima, one maximum near atomic composition Ni72Pd28 and the other near Ni30Pd70. The resistivities of Ni1-xPdx films deposited on the a-alumina substrates are 30% larger than the resistivities of the Ni1-xPdx films deposited on the glass-Corning substrates. When one changes the degree of order in the mixture (Ni, Pd) while passing from a solid solution NixPd1-x to bilayers Ni/Pd films, the apparent resistivity decreases by a factor larger than 2.

Recommended Citation

K. Loudjani, M. and Sella, C. (2021) "Resistivity of Bilayers Ni/Pd Films and Ni1-xPdx Alloys Films," International Journal of Thin Film Science and Technology: Vol. 10 : Iss. 1 , PP -.
Available at: https://digitalcommons.aaru.edu.jo/ijtfst/vol10/iss1/10