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International Journal of Thin Film Science and Technology

International Journal of Thin Film Science and Technology

Abstract

In this work we propose to measure the resistivities of bilayer Ni/Cu and tri-layer Ni/Pd/Cu thin films. We will compare the experimental resistivity of bilayer Ni/Cu or a tri-layerNi/Pd/Cu to the resistivity calculated from the resistivities of the simple layers of copper, nickel and palladium. We show that in the presence of aconstantelectric fieldparallel to the interface of Ni/Cu, electronic transport in bilayer, is equivalent to that of two distinct layers (of Ni and Cu) laid out in two parallel circuits, and that of a tri-layer Ni/Pd/Cu is equivalent to that the electronic transport of three distinct layers (of Ni, Pd and Cu) laid out in three parallel circuits.

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